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| SHINDENGEN General Purpose Rectifiers SIL Bridges D20XB60 600V 20A FEATURES *oehin Single In-Line Package T *oe High current capacity with Small Package *oe High IFSM *oe Superior Thermal Conductivity APPLICATION OUTLINE DIMENSIONS Case : 5S Unit : mm *oe power supply Switching *oe Home Appliances, Office Equipment *oe Factory Automation, Inverter RATINGS *oeAbsolute Maximum Ratings (If not specified Tc=25*Z) Item Symbol Conditions RatingsUnit Storage Temperature Tstg -40*150*Z Operating Junction Temperature Tj 150 *Z V Maximum Reverse Voltage RM 600 V IO Current Average Rectified Forward50Hz sine wave, R-load With heatsink 20 Tc=87*Z A 50Hz sine wave, R-load Without heatsink Ta=25*Z 3.5 IFSM Peak Surge Forward Current sine wave, Non-repetitive 1cycle peak value, Tj=25 50Hz 240 A 2 Current Squared TimeI2 1ms*...t*10ms*@Tj=25*Z t 200 As Dielectric Strength Vdis Terminals to case, AC 1 minute 2.5 kV Mounting Torque TOR* ecommended torque*0.5Nm*j R i F 0.8 Nm *oeElectrical Characteristics (If not specified Tc=25*Z) Item Symbol Conditions RatingsUnit V I =10A, Pulse measurement, Rating of per diode Forward Voltage Max.1.1 V FF IR V=V,M Reverse Current Max.10EA R R Pulse measurement, Rating of per diode AEjc junction to case *@*@With heatsink Max.1.5 Thermal Resistance AEjljunction to lead *@*@ Without heatsink Max.5*Z/W AEja junction to ambient Without heatsink Max.22 Copyright & Copy;2000 Shindengen Electric Mfg.Co.Ltd D20XBx 100 Forward Voltage 10 Forward Current IF [A] Tc=150C [TYP] Tc=25C [TYP] 1 Pulse measurement per diode 0.1 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 Forward Voltage VF [V] D20XBx 80 70 Forward Power Dissipation Forward Power Dissipation PF [W] SIN 60 50 40 30 20 10 0 0 5 10 15 20 25 30 Average Rectified Forward Current IO [A] Tj = 150C Sine wave D20XBx 30 Derating Curve Heatsink Tc Tc Average Rectified Forward Current IO [A] 25 SIN 20 15 10 5 0 80 90 100 110 120 130 140 150 160 Case Temperature Tc [C] Sine wave R-load with heatsink D20XBx 5 Derating Curve Average Rectified Forward Current IO [A] 4 SIN PCB Glass-epoxy substrate Soldering land 5mm 3 2 1 0 0 20 40 60 80 100 120 140 160 Ambient Temperature Ta [C] Sine wave R-load Free in air D20XBx 300 Peak Surge Forward Capability IFSM 10ms 10ms 250 1 cycle Peak Surge Forward Current IFSM [A] non-repetitive, sine wave, Tj=25C before surge current is applied 200 150 100 50 0 1 2 5 10 20 50 100 Number of Cycles [cycles] |
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